Iinkonzo zoMatshini oNgcono kwiMveliso ye-Elektroniki kunye ne-Semiconductor

Ukubonelela ngezinto eziphambili ezichanekileyo kakhulu kumashishini e-elektroniki kunye ne-semiconductor

Kutheni ukhetha iinkonzo zeKansd zokulungisa ngokuchanekileyo izixhobo ze-elektroniki kunye nee-semiconductor?

I-Shenzhen Kansd Technology Co., Ltd. (eqinisekisiwe yi-ISO 9001:2015 kunye ne-ISO 14001) igxile kakhulu kwicandelo lokuvelisa izinto ze-elektroniki kunye neze-semiconductor. Izimisele ukucubungula izinto ze-semiconductor kunye neze-elektroniki ngokuchanekileyo kwinqanaba le-nanometer (± 0.0005mm). Ububanzi beshishini layo bugubungela iindawo ezifana nezixhobo zokuvelisa iitshiphusi, ukupakishwa kwe-semiconductor, kunye nezinto eziphambili zeemveliso ze-elektroniki. Inikezele ngezixhobo ezingaphezulu kwezigidi ezi-5 ezichanekileyo, inceda abathengi ukuphucula ukusebenza kwemveliso kunye nokusebenza kakuhle kwemveliso.

1. Inkqubo yezinto ezihambelanayo

Ugutyungelwe yiMpahla epheleleyo: Igubungela izinto ezahlukeneyo ezifana nee-silicon wafers, i-silicon carbide, i-gallium nitride, i-aluminium alloy 6061-T6, kunye ne-copper alloy C11000, ukuhlangabezana neemfuno zezixhobo ezahlukeneyo ze-elektroniki kunye ne-semiconductor ngokubhekiselele ekusebenzeni, ukusasazwa kobushushu, kunye nokuzinza kobukhulu.

Ukuhambelana kwesakhiwo: Ixhasa ukucutshungulwa kweendawo ezintsonkothileyo zesakhiwo ezifana nee-chip carriers (ukunyamezelana kobukhulu ±0.01mm) kunye nee-vacuum chambers zezixhobo ze-semiconductor (uburhabaxa bomphezulu i-Ra0.2μm).

2. Ulawulo oluchanekileyo lweNqanaba leMveliso yoBuninzi

Imigangatho Yokunyamezelana Okungqongqo: Ukuchaneka komatshini wokugaya i-CNC yi-±0.002mm, kwaye ukuchaneka kokulungelelaniswa kwe-lithography yi-±0.0005mm.

Ukulinganisa Ubungqingqwa: Kwinkqubo ye-semiconductor wafer, ubungqingqwa bomphezulu we-wafer yi-≤0.0005mm, okuqinisekisa inkqubela phambili egudileyo ye-lithography, ukukrola, kunye nezinye iinkqubo ngexesha lokwenziwa kweetships.

3. Amandla eNkqubo eDibeneyo

Izisombululo Zonyango Lomphezulu: Ukupholisha Kweekhemikhali (i-CMP) kunokufikelela kwi-wafer surface roughness ye-Ra ≤ 0.01nm; Ukucocwa kweplasma kunokususa iintsalela zezinto eziphilayo kumphezulu ukuqinisekisa ukucoceka okuphezulu kwezinto.

Iinkqubo Ezikhethekileyo Zokugquma: Ingubo ye-titanium nitride (ubulukhuni be-HV2000) inokuphucula ukumelana nokuguguleka komphezulu wokungunda; Ingubo ye-Polytetrafluoroethylene (i-friction coefficient ≤ 0.05) isetyenziswa kwiindawo ezihambayo zezixhobo ze-semiconductor ukunciphisa ilahleko zokungqubana.

1. Izixhobo Zokwenza Iitships

Izinto ezisetyenziswa kwiimashini zeLithography: Izihlalo zokufaka ilensi ezijolise ekuboniseni (ukuchaneka kokubeka ±0.0005mm), izixhobo zokubopha ezijikelezayo (ukuthamba ≤ 0.001mm).

Izinto ezisetyenziswa kwiimashini zokuQopha: Amagumbi okusabela (ukuxhathisa ukugqwala okuphezulu, uburhabaxa bomphezulu i-Ra0.2μm), abasasazi begesi (ukunyamezelana kobubanzi bemingxuma ±0.001mm).

2. Ukupakishwa kwe-semiconductor

IiPakishela: IiPakishela zeceramic ezinee-layer ezininzi (ububanzi bomgca/i-pitch yomgca ≤ 25μm), ii-substrates zepakethe ze-organic (ukuthe tyaba ≤ 0.02mm).

Iifreyimu zeLead: Iifreyimu zelead ze-copper alloy (ukuchaneka kokubhoboza ±0.01mm) ukuhlangabezana neemfuno zokupakisha okuxineneyo.

3. Izinto eziphambili zeemveliso ze-elektroniki

Iifowuni eziphathwayo: Iibrakethi zemodyuli yekhamera (ubukhulu obuphakathi ≤ 0.002mm), ii-heat sinks zebhodi yomama (iphimbo le-heat sink fin ±0.05mm).

Iikhompyutha zeLaptop: Iziseko zesinki yobushushu beCPU (ubukhulu obuthe tyaba ≤ 0.01mm), ii-drive enclosures ezikwimeko eqinileyo (ukunyamezelana okulinganayo ±0.03mm).

1. Ukuqinisekiswa kweMfuneko: Fumana imizobo/iimodeli ze-3D (kwi-CAD/ProE kunye nezinye iifomathi) kwaye unikezele ngohlalutyo lokwenziwa kwe-DFM.

2. Uphuhliso lweNkqubo: Phuhlisa indlela yenkqubo uze ugcwalise iphakheji yamaxwebhu e-PPAP (kuquka iingxelo ze-PSW kunye ne-MSA).

3. Ukuqinisekiswa kweMveliso yoLingo: Nika iisampulu kunye neengxelo zobungakanani obupheleleyo (ngokuhambelana nemigangatho yoshishino).

4. Ulawulo lweMveliso eNinzi: Sebenzisa ukubekwa esweni kwenkqubo ye-SPC kwaye uxhase ukunikezelwa kwe-JIT ngexesha elifanelekileyo.

Iprojekthi yeZixhobo zoKwenziwa kweeChip: Izihlalo zokufakelwa kwelensi eziveliswe ngobuninzi zomenzi wezixhobo ze-semiconductor zasekhaya owaziwayo, ngokuchanekileyo kwe-±0.0005mm, kwaye izinga lokuvelisa izixhobo linyuke laya kwi-95%.

Isithwali sokuPakisha seSemiconductor: Izithwali zeseramikhi ezicutshungulwayo ezineengqimba ezininzi zenkampani ephambili yokupakisha, enobubanzi bomgca/umgca we-25μm, ezihlangabezana neemfuno zeenkqubo zokupakisha eziphambili.

Imodyuli yeKhamera yeSmartphone: Iibrakethi zemodyuli yekhamera ezibonelelweyo zohlobo oluthile lwefowuni ephathwayo, kunye nobunzulu obulawulwa ngaphakathi kwe-±0.002mm, nto leyo ephucula ngokufanelekileyo ukucaca kwefoto.

Ukuqinisekiswa kokuthobela imithetho: Inkqubo yokulandelela izinto igubungela yonke inkqubo ukusuka ekuthengweni kwezinto eziluhlaza ukuya ekuhanjisweni kwemveliso, ixhasa ukungeniswa kweengxelo zokuthobela imithetho.

Ukuhanjiswa kweNtsebenziswano kwiHlabathi liphela: Amaqela azimeleyo okungenisa nokuthumela impahla kwamanye amazwe axhasa ukucocwa kwempahla kumazwe ngamazwe kwaye aphendula ngokukhawuleza kwiimfuno zabathengi behlabathi.

Uphuhliso lweNtsebenziswano yoBugcisa: Kuphuculwe ngokudibeneyo inkqubo yeendawo zokwakha zokusasazwa kobushushu ze-RF chip ze-5G kunye nabathengi, nto leyo ephucula kakhulu ukusebenza kakuhle kokusasazwa kobushushu.

Fumana isisombululo somatshini wokulungisa ngokuchanekileyo we-elektroniki kunye ne-semiconductor ngoku →

Ngenisa iinkcukacha zakho zobugcisa kwaye ufumane isicwangciso senkqubo esipheleleyo kunye nekoteshini ekumgangatho ophezulu kwiiyure ezingama-24!