Litšebeletso tsa Machining tse Nepahetseng bakeng sa Tlhahiso ea Elektroniki le Semiconductor

Ho fana ka likarolo tsa mantlha tse nepahetseng haholo bakeng sa liindasteri tsa lisebelisoa tsa elektroniki le tsa semiconductor

Hobaneng o lokela ho kgetha ditshebeletso tsa ho sebetsa ka ho nepahala ha Kansd bakeng sa di-elektroniki le di-semiconductor?

Shenzhen Kansd Technology Co., Ltd. (e netefalitsoeng ho ISO 9001:2015 & ISO 14001) e metse ka metso tšimong ea tlhahiso ea lisebelisoa tsa elektroniki le tsa semiconductor. E ikemiselitse ho sebetsana le likarolo tsa semiconductor le tsa elektroniki ka ho nepahala ha boemo ba nanometer (± 0.0005mm). Sebaka sa eona sa khoebo se akaretsa libaka tse kang lisebelisoa tsa tlhahiso ea chip, liphutheloana tsa semiconductor, le likarolo tsa mantlha tsa lihlahisoa tsa elektroniki. E fane ka likarolo tse fetang limilione tse 5 tse nepahetseng haholo, e thusa bareki ho ntlafatsa ts'ebetso ea sehlahisoa le katleho ea tlhahiso.

1. Sistimi e lumellanang ea Lintho

Kakaretso e Felletseng ea Thepa: E akaretsa mefuta e fapaneng ea thepa e kang li-wafer tsa silicon, silicon carbide, gallium nitride, alloy ea aluminium 6061-T6, le alloy ea koporo C11000, e fihlelang litlhoko tsa lisebelisoa tse fapaneng tsa elektroniki le tsa semiconductor mabapi le ts'ebetso, ho qhala ha mocheso le botsitso ba litekanyo.

Ho Tsamaellana ha Sebopeho: E tshehetsa tshebetso ya dikarolo tse rarahaneng tsa sebopeho tse kang di-chip carriers (mamello ya botenya ± 0.01mm) le dikamore tsa vacuum tsa disebediswa tsa semiconductor (bokgoni ba bokahodimo Ra0.2μm).

2. Taolo e Nepahetseng ea Boemo ba Tlhahiso ea Boima

Maemo a Tiileng a Mamello: Ho nepahala ha machining ha CNC silling ke ± 0.002mm, 'me ho nepahala ha ho hokahanya lithography ke ± 0.0005mm.

Tekanyo ea Bophara: Bakeng sa ts'ebetso ea wafer ea semiconductor, bophara ba bokaholimo ba wafer ke ≤0.0005mm, ho netefatsa tsoelo-pele e boreleli ea lithography, ho fata, le lits'ebetso tse ling nakong ea tlhahiso ea chip.

3. Bokhoni ba Ts'ebetso e Kopantsoeng

Litharollo tsa Kalafo ea Bokaholimo: Ho Hloekisa Mechanical ea Lik'hemik'hale (CMP) ho ka finyella ho hlaka ha bokaholimo ba wafer ba Ra ≤ 0.01nm; Ho hloekisa plasma ho ka tlosa masala a lintho tse phelang holim'a bokaholimo ho netefatsa bohloeki bo phahameng ba likarolo.

Mekhoa e Ikhethang ea ho Koahela: Koahelo ea titanium nitride (thata HV2000) e ka ntlafatsa khanyetso ea ho tsofala ha bokaholimo ba hlobo; Koahelo ea Polytetrafluoroethylene (koefficient ea khohlano ≤ 0.05) e sebelisoa likarolong tse tsamaeang tsa lisebelisoa tsa semiconductor ho fokotsa tahlehelo ea khohlano.

1. Lisebelisoa tsa Tlhahiso ea Li-chip

Likarolo tsa Mechini ea Lithography: Litulo tsa ho kenya lense tse nang le sepheo sa projekte (ho nepahala ha ho beha ±0.0005mm), lisebelisoa tsa ho khomarela reticle (bophara ≤ 0.001mm).

Likarolo tsa Mechini ea ho Sebetsa ka ho Ngola: Likamore tsa karabelo (ho hanyetsa ho hoholo ha mafome, ho ba thata ha bokaholimo Ra0.2μm), baabi ba khase (ho mamella bophara ba masoba ±0.001mm).

2. Sephutheloana sa Semiconductor

Lijari tsa ho Paka: Lijari tsa letsopa tse nang le mekhahlelo e mengata (bophara ba mola/sekontiri sa mola ≤ 25μm), li-substrate tsa ho paka tsa tlhaho (bophara ≤ 0.02mm).

Diforeimi tsa Loto: Diforeimi tsa loto tsa alloy ya koporo (ho nepahala ha ho phunya ±0.01mm) ho fihlela ditlhoko tsa sephutheloana se nang le bongata bo boholo.

3. Likarolo tsa Bohlokoa tsa Lihlahisoa tsa Elektroniki

Li-smartphone: Masakaneng a module ea khamera (concentricity ≤ 0.002mm), li-heat sinks tsa motherboard (sebaka sa mapheo a sink ea mocheso ± 0.05mm).

Lik'homphieutha tsa Laptop: Metheo ea sinki ea mocheso ea CPU (bophara ≤ 0.01mm), li-drive enclosures tsa boemo bo tiileng (mamello ea litekanyo ± 0.03mm).

1. Netefatso ea Tlhokahalo: Amohela litšoantšo/mehlala ea 3D (ka CAD/ProE le mekhoa e meng) 'me u fane ka tlhahlobo ea tlhahiso ea DFM.

2. Ntlafatso ea Ts'ebetso: Hlahisa tsela ea ts'ebetso 'me u tlatse sephutheloana sa litokomane tsa PPAP (ho kenyeletsoa le litlaleho tsa PSW le MSA).

3. Netefatso ea Tlhahiso ea Pilot: Fana ka disampole le litlaleho tsa boholo bo felletseng (ho latela maemo a indasteri).

4. Tsamaiso ea Tlhahiso e Kholo: Kenya tšebetsong tlhokomelo ea ts'ebetso ea SPC le ho tšehetsa phepelo ea JIT ka nako e nepahetseng.

Morero oa Lisebelisoa tsa Tlhahiso ea Li-chip: Litulo tse ngata tsa ho kenya lense tse nang le sepheo sa projeke tse hlahisitsoeng bakeng sa moetsi oa lisebelisoa tsa semiconductor tsa lapeng tse tsebahalang, ka ho nepahala ha ±0.0005mm, 'me sekhahla sa tlhahiso ea lisebelisoa se eketsehile ho fihla ho 95%.

Sepakete sa ho Paka sa Semiconductor: Sepakete sa letsopa se sebetsitsoeng ka mekhahlelo e mengata bakeng sa k'hamphani e etellang pele ea ho paka, se nang le bophara ba mola/mola oa 25μm, se fihlelang litlhoko tsa lits'ebetso tse tsoetseng pele tsa ho paka.

Mojule oa Khamera oa Smartphone: Ho fanoe ka li-bracket tsa mojule oa khamera bakeng sa mofuta o itseng oa mohala oa selefouno, ka ho tsepamisa mohopolo ho laoloang ka har'a ± 0.002mm, e leng se ntlafatsang ho hlaka ha foto ka katleho.

Netefatso ea ho Latela Melao: Sistimi ea ho latela thepa e akaretsa ts'ebetso eohle ho tloha ho rekoeng ha thepa e tala ho isa ho tlisoeng ha sehlahisoa, e tšehetsang ho romelloa ha litlaleho tsa ho latela melao ea thepa.

Phepelo ea Tšebelisano-'moho Lefatšeng ka Bophara: Lihlopha tsa ho kenya le ho romela thepa kantle ho naha tse itšebetsang li tšehetsa ho amoheloa ha thepa ea machaba ea thepa le ho arabela ka potlako litlhokong tsa bareki ba lefats'e ka bophara.

Nts'etsopele ea Tšebelisano-'moho ea Tekheniki: Ts'ebetso ea likarolo tsa sebopeho sa ho qhala mocheso oa RF chip ea setsi sa 5G e ntlafalitsoe hammoho le bareki, e ntlafatsa haholo bokhoni ba ho qhala mocheso.

Fumana tharollo ea ho sebetsa ka ho nepahala ha mechini ea elektroniki le ea semiconductor hona joale →

Romela litlhaloso tsa hau tsa tekheniki 'me u fumane moralo o felletseng oa ts'ebetso le khotheishene e arotsoeng ka mekhahlelo nakong ea lihora tse 24!