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Mabasa Ekugadzira Machining Akakodzera Ekugadzira Magetsi uye Semiconductor
2025-08-11
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Kupa zvikamu zvepakati zvakanyatsonaka zvemaindasitiri emagetsi nesemiconductor
Sei uchifanira kusarudza masevhisi eKansd ekugadzira michina nemasemiconductors nemazvo?
Shenzhen Kansd Technology Co., Ltd. (yakabvumidzwa neISO 9001:2015 & ISO 14001) yakadzika midzi mumunda wekugadzira zvemagetsi uye zve semiconductor. Yakazvipira kugadzirisa zvikamu zve semiconductor uye zvemagetsi zvine kurongeka kwemazinga e nanometer (± 0.0005mm). Bhizinesi rayo rinofukidza nzvimbo dzakadai semidziyo yekugadzira chip, kurongedza zve semiconductor, uye zvikamu zvikuru zvezvigadzirwa zvemagetsi. Yakapa zvikamu zvinopfuura mamiriyoni mashanu zvakanyatsonaka, zvichibatsira vatengi kuvandudza mashandiro ezvigadzirwa uye kushanda zvakanaka kwezvigadzirwa.
Zvakanakira Zvikuru
1. Sisitimu Yezvinhu Inoenderana
Kufukidzwa Kwakazara Kwezvinhu: Inofukidza zvinhu zvakasiyana-siyana zvakaita sesilicon wafers, silicon carbide, gallium nitride, aruminiyamu alloy 6061-T6, uye copper alloy C11000, ichizadzisa zvinodiwa zvemagetsi akasiyana-siyana uye semiconductor zvishandiso maererano nekushanda, kupisa, uye kugadzikana kwezvikamu.
Kuenderana kwechimiro: Inotsigira kugadziriswa kwezvikamu zvakaoma zvechimiro zvakaita sezvinotakura machipisi (kushivirira ukobvu ±0.01mm) uye makamuri evacuum emidziyo ye semiconductor (kuoma kwenzvimbo Ra0.2μm).
2. Kudzora Kunyatsogadzirwa Kwehuwandu Hwehuwandu
Mitemo Yekushivirira Zvakasimba: Kururama kwekushandiswa kweCNC milling kuri ±0.002mm, uye kunyatsorongeka kwe lithography kuri ±0.0005mm.
Kuenzanisa Kutsetseka: Pakugadzirisa mawafer e semiconductor, kutsetseka kwepamusoro kwewafer kunosvika ≤0.0005mm, zvichiita kuti lithography, etching, uye mamwe maitiro afambe zvakanaka panguva yekugadzira machip.
3. Kugona Kwekugadzira Zvinhu Zvakasanganiswa
Mhinduro dzeKurapa Pamusoro: Kupukuta Kwemakemikari (CMP) kunogona kuita kuti pave nekuomarara kweRa ≤ 0.01nm; Kuchenesa plasma kunogona kubvisa zvasara zve organic pamusoro kuti zvive nechokwadi chekuchena kwakanyanya kwezvikamu.
Maitiro Akakosha Ekuvhara: Kuvhara kweTitanium nitride (kuoma kweHV2000) kunogona kuvandudza kuramba kwekupfekwa kwenzvimbo yeforoma; Kuvhara kwePolytetrafluoroethylene (friction coefficient ≤ 0.05) kunoiswa pazvikamu zvinofamba zvemidziyo yesemiconductor kuderedza kurasikirwa kwekukweshana.
Nzvimbo Dzakakosha dzeKushandisa
1. Midziyo yekugadzira machipisi
Zvikamu zveMichina yeLithography: Zvigaro zvekuisa lenzi yeProjekti (kunyatsorongeka kwekuisa ±0.0005mm), zvishandiso zvekusunga reticle (flatness ≤ 0.001mm).
Zvikamu zveMichina yeKucheka: Makamuri ekuita zvinhu (kupikisa ngura zvakanyanya, kuomarara kwepamusoro Ra0.2μm), zvinogovera gasi (kushivirira dhayamita yegomba ±0.001mm).
2. Kurongedza Semiconductor
Zvifambiso zveKurongedza: Zvifambiso zveceramic zvakawanda (upamhi hwemutsetse/mutsara wemutsetse ≤ 25μm), zvigadziko zvepurasitiki zveorganic (zvakatsetseka ≤ 0.02mm).
Mafuremu eLead: Mafuremu eLead eCopper alloy (kunyatsobaya ±0.01mm) kuti akwane zvinodiwa pakurongedza kwakawanda.
3. Zvikamu Zvikuru zveZvigadzirwa zveMagetsi
Mafoni: Mabhureki emodule yekamera (concentricity ≤ 0.002mm), masinki ekupisa emotherboard (heat sink fin pitch ±0.05mm).
Makomputa eLaptop: Zvigadziko zveCPU heat sink (flatness ≤ 0.01mm), solid-state drive enclosures (dimensional tolerance ±0.03mm).
Matrix yeKugona kweUnyanzvi
Chiratidzo | Paramita |
Kururama Kwepamusoro-soro Kwekugadzira Machining | Kugaya ±0.002mm, Kurongeka kweLithography ±0.0005mm |
Kuoma Kwepamusoro Kwakajairika | Ra0.1 - 0.4μm (nzvimbo dzakapfava zvakanyanya dzinogona kugadziriswa) |
Kuenderana Kwekugadzirwa KwemaBatch | CPK ≥ 1.67 (100% kuongororwa kwakazara kwezvikamu zvakakosha) |
Kugadzira Machining eMicrostructure | Upamhi hweMutsetse/Kukwira kweMutsetse 25μm, Chiyero cheAspect 10:1 |
Kugona Kwekugadzira Kwemwedzi Nemwedzi | Zvikamu zve 800,000 zvakanyatsonaka, maodha ekukurumidzira anogona kupindurwa mukati memazuva maviri |
Maitiro Ebasa
1. Kusimbiswa kwezvinodiwa: Gamuchira mifananidzo/3D modhi (muCAD/ProE nedzimwe nzira) uye ongorora kugona kugadzira zvinhu muDFM.
2. Kugadzira Maitiro: Gadzira nzira yemaitiro uye pedzisa gwaro rePPAP (kusanganisira mishumo yePSW neMSA).
3. Kusimbiswa Kwekugadzirwa Kwemutyairi: Tumirai mienzaniso nemishumo yakazara (zvinoenderana nezvinodiwa neindasitiri).
4. Kutarisira Kugadzirwa Kwakawanda: Ita kuti maitiro eSPC atariswe uye tsigira JIT panguva chaiyo.
Nyaya Dzinozivikanwa Neindasitiri
Purojekiti yeZvishandiso zveKugadzira Machipisi: Zvigaro zvekuisa magirazi zvakagadzirwa nemakambani anozivikanwa ekugadzira michina ye semiconductor, zvine kururama kwe ±0.0005mm, uye mwero wekubudirira kwemidziyo wakawedzera kusvika 95%.
Semiconductor Packaging Carrier: Zvigadzirwa zveceramic zvakagadzirwa nemakambani makuru ekutakura zvinhu, zvine mutsetse wakafara/mutsetse we25μm, zvichizadzisa zvinodiwa nemaitiro epamusoro ekutakura zvinhu.
Module yeKamera yeSmartphone: Yakapihwa mabhureki emodule yekamera yemhando yerumwe runharembozha, ine kuzara kunodzorwa mukati me ±0.002mm, zvichinyatso vandudza kujeka kwemufananidzo.
Kukosha Kwakawedzerwa
Kuvimbisa Kutevedza Mutemo: Sisitimu yekutevedza zvinhu inovhara maitiro ese kubva pakutenga zvinhu kusvika pakuendesa zvigadzirwa, ichitsigira kuendeswa kwemishumo yekutevedzera mitemo yezvinhu.
Kuendeswa Kwebasa Pamwe Chete Pasirose: Mapoka ekutumira nekutumira zvinhu kunze kwenyika anozvishandira ega anotsigira kubvumidzwa kwemitengo yepasi rose uye anokurumidza kupindura zvinodiwa nevatengi vepasi rose.
Kuvandudzwa kweKushanda Pamwe Chete: Kugadzirisa pamwe chete maitiro e5G base station RF chip heat dissipation structure parts nevatengi, zvichivandudza zvakanyanya kushanda kwekupisa.
Wana mhinduro yemagetsi ne semiconductor chaiyo yekugadzira michina izvozvi →
Tumira hunyanzvi hwako uye uwane hurongwa hwakazara hwekuita uye mutengo wetiered mukati memaawa makumi maviri nemana!